LTE Small Cell Mainboard (HMB73xx)

This PCB is a universal hardware platform for LTE-Advanced microcells. Thanks to a robust eNodeb baseband block, advanced Digital Front-End features and high quality RF circuits could be used as a module in various 4G small cell types.

RF channels

4

LTE throughput

max. 400/200 Mbps DL/UL

Simultaneous UE

512+

Synchronization

GPS

Universal LTE-Advanced carrier-grade microcell main board

This module implements complete eNodeB baseband block, including Digital Front-End and Transceiver RF. This solution, thanks to robust small cell SoC platform, delivers outstanding performance while keeping physical footprint low. Moreover, due to field programmable DFE and broadly tunable RF circuits, this hardware subsystem can support a range of eNodeB radio configurations. Apart from that, it features Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) processing blocks, which allow for achieving the best efficiency of TX Power Amplifiers.

Values

Broad RF tuning range

eNodeB on a board

Advanced Digital Front-End

Outstanding system performance

Specifications

Parameter Value
RAN technologyLTE Advanced
Maximum throughput400/200 Mbps DL/UL
Duplex modeTDD and FDD
Simultaneous UE512+
Sector configuration1 or 2 MIMO 2x2 sectors, 2 or 4 SISO sectors
Carrier aggregationUp to 20+20MHz per sector or 4x20MHz in one sector
Network interfaceUp to 2 x 10/100/1000Baset-T, 1 x SFP 1000Base-LX
SynchronizationGPS
Digital Front-End featuresDUC/DDC, CFR, DPD, I/Q diagnostic
RF tunning range00 ¸ 6000MHz
RF ports4 Tx, 4 Rx, 4 ORx

Applications