Mechanical design

See also:

Hardware design
FPGA Design

We support our customers in the mechanical aspect. Depending on the specifics of your project, we provide services such as:

  • Enclosure and heat sink design,
  • Consultancy in the field of assembly and selection of mechanical solutions in terms of heat dissipation as well as shielding of telecommunications devices. We cooperate in the field of assembly of electronic components and production of housings,Simulation of temperature distribution of electronics components using CAD software,
  • Testing of telecommunication equipment using climatic chamber (temperature range: from -40°C to 180°C),
  • Tests of the impact of environmental conditions on telecommunication equipment in accordance with IP standards (dustproof and waterproof tests),
  • Testing of the compliance of telecommunications devices with the basic requirements of the RED and EMC directives, including EMC electromagnetic compatibility, radio compatibility and safety of use of electronic devices.